(ÁÖ)»÷µð¾Æ´Â »õ·Î¿î Intel® Xeon® Platinum 9200 ½Ã¸®Áî ÇÁ·Î¼¼¼­ ±â¹ÝÀÇ ¼­¹ö Ç÷§ÆûÀ» Ãâ½ÃÇÏ¿´½À´Ï´Ù. »õ·Î¿î ¼­¹ö Ç÷§ÆûÀº NEXTSERVER¢â R2292WK 2U4NODE (NS R2292WK) ÀÔ´Ï´Ù.

 

°í¼º´É ÄÄÇ»Æà (HPC) ¹× Àΰø Áö´É ÀÀ¿ë ºÐ¾ß¿¡¼­ ÃÖÀûÈ­µÈ NS R2292WKÀº Intel® Xeon®Platinum 9200 ÇÁ·Î¼¼¼­°¡ »ç¿ëµÇ´Â ÃÖ½ÅÀÇ ¼­¹ö Ç÷§Æû ÀÔ´Ï´Ù.

 

 

 

ÀÎÅÚ® ¼­¹ö ½Ã½ºÅÛ S9200WK Á¦Ç°±ºÀº °í¼º´É ÄÄÇ»ÆÃ(HPC) ¹× Àΰø Áö´É ÀÀ¿ë ºÐ¾ß¿¡ »ç¿ëÇϱ⿡ ÀÌ»óÀûÀÎ ¸ÂÃã ±¸ÃàµÈ ¼º´É ÃÖÀûÈ­ µ¥ÀÌÅÍ ¼¾ÅÍÀÔ´Ï´Ù. ÄÄÇ»Æà ¸ðµâ´ç ÃÖ´ë 24°³ÀÇ DDR4 DIMM ½½·ÔÀÌ Àִ 2¼¼´ë ÀÎÅÚ® Á¦¿Â® Ç÷¡Æ¼³Ñ 9200 ÇÁ·Î¼¼¼­¿ëÀ¸·Î ¼³°èµÈ ÀÎÅÚ® ¼­¹ö ½Ã½ºÅÛ S9200WK Á¦Ç°±ºÀº ÇÁ·Î¼¼¼­ ¹× ¸Þ¸ð¸® ´ë¿ªÆøÀ» ±Ø´ëÈ­ÇÏ¿© °¡Àå ±î´Ù·Î¿î ÄÄÇ»Æà »ç¿ëµµ ÃæÁ·ÇÒ ¼ö ÀÖ´Â ÃÖ°í ¼öÁØÀÇ ¼º´ÉÀ» Á¦°øÇÕ´Ï´Ù.

 

 

 

 

 

ÃÖ°í ¼º´ÉÀÇ 2¼¼´ë Intel® Xeon® Platinum 9200 ÇÁ·Î¼¼¼­

 

 

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ÀÎÅÚ¿¡¼­ °¡Àå ¸¹Àº ÄÚ¾î ¼ö¿Í ¼ÒÄÏ´ç ÃÖ°íÀÇ CPU ¼º´ÉÀ» º¸¿©ÁÖ´Â 2¼¼´ë Intel® Xeon® Platinum 9200 ÇÁ·Î¼¼¼­

 

 

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¸Þ¸ð¸® Áý¾àÀû ¿öÅ©·Îµå¸¦ À§ÇØ CPU´ç 12°³ÀÇ ¸Þ¸ð¸® ä³Î, ÄÄÇ»Æà ¸ðµâ´ç 24 ¸Þ¸ð¸® ä³ÎÀ» ÅëÇØ 2¹èÀÇ ¸Þ¸ð¸® ´ë¿ªÆø Á¦°ø

 

 

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µ¥ÀÌÅÍ ºÐ¼®À» À§ÇÑ »õ·Î¿î Intel® Deep Learning Boost (ÀÎÅÚ DL ºÎ½ºÆ®) ÁöħÀ¸·Î Ãß·Ð ¼º´ÉÀ» Å©°Ô ³ôÀ½

 

 

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¹Ðµµ ¹× ¼º´É¿¡ ÃÖÀûÈ­µÈ ¸ÖƼĨ ÆÐŰ¡

 

 

 

 

 

¹Ðµµ¿¡ ÃÖÀûÈ­µÈ 2U ·¢ ¼­¹ö, °ø³Ã Ä𸵠¹× ¼ö³Ã Ä𸵠¿É¼Ç

 

 

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´ÜÀÏ ¼¨½Ã¿¡¼­ ¿©·¯ ÄÄÇ»Æà ¸ðµâ À¯ÇüÀ» Áö¿øÇÏ´Â 2U ¼¨½Ã´ç ÃÖ´ë 4°³ÀÇ ÄÄÇ»Æà ¸ðµâ

 

 

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³ôÀº ¿­Àü´ÞÀ²À» À§ÇØ CPU, VR, DIMM ¹× ¸Þ¸ð¸® VR¿¡ ´ëÇØ ³ôÀº È帧À²ÀÇ °ø³Ã½Ä/¼ö³Ã½Ä Äð¸µÀ» Á¦°øÇÏ´Â °í±Þ Ä𸵠±â¼úÀ» °áÇÕÇÑ 2CPU ÄÄÇ»Æà ¸ðµâ µðÀÚÀÎ

 

 

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°í¼º´É ¿öÅ©·Îµå¸¦ À§ÇØ 2U °ø·©½Ä Ä𸵠¼¨½Ã¿¡¼­ ÃÖ´ë 350W ÇÁ·Î¼¼¼­ TDP, ¼ö³Ã½Ä Ä𸵠¹öÀü¿¡¼­ ÃÖ´ë 400W ÇÁ·Î¼¼¼­ TDP Áö¿ø

 

 

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³×Æ®¿öÅ© È®Àå ¿É¼ÇÀ» À§ÇØ 1U ÄÄÇ»Æà ¸ðµâ¿¡¼­ 6 PCIe ½½·Ô ÃÖ´ë 2°³, 2U ÄÄÇ»Æà ¸ðµâ¿¡¼­ 16 PCIe* ½½·Ô ÃÖ´ë 4°³ Áö¿ø

 

 

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1U ÄÄÇ»Æà ¸ðµâ´ç M.2 SATA/NVMe ½ºÅ丮Áö ÀåÄ¡ 2°³, M.2 SATA/NVMe* ÃÖ´ë 2°³, 2U ÄÄÇ»Æà ¸ðµâ´ç U.2 NVMe ½ºÅ丮Áö ÀåÄ¡ ÃÖ´ë 2°³ Áö¿ø

 

 

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ÇÖ ½º¿Ò Áö¿ø ÄÄÇ»ÅÍ ¸ðµâ, ½ºÅ丮Áö, ÆÒ ¹× Àü¿ø °ø±ÞÀåÄ¡

 

 

 

 

 

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(ÁÖ)»÷µð¾Æ NS R2292WK Á¦Ç°±ºÀº ÀÎÅÚ® µ¥ÀÌÅÍ ¼¾ÅÍ ºí·Ï(ÀÎÅÚ® DCB) Áß ÃÖ°í ¼º´ÉÀ» ÀÚ¶ûÇÕ´Ï´Ù. È®½ÇÇÏ°Ô °ËÁõµÇ°í ºê·£µå°¡ ¾ø´Â ÀÌ ¼­¹ö ½Ã½ºÅÛ¿¡´Â ¿øÈ°È÷ ÀÛµ¿Çϵµ·Ï ÀÌ¹Ì ÃÖÀûÈ­µÈ ÀÎÅÚÀÇ ÃֽŠµ¥ÀÌÅÍ ¼¾ÅÍ ±â¼úÀÌ Æ÷ÇԵǾî ÀÖ¾î, ÆÄÆ®³ÊµéÀº ½Å·ÚÇÒ ¼ö ÀÖ´Â µ¥ÀÌÅÍ ¼¾ÅÍ ¼Ö·ç¼ÇÀ¸·Î ½ÃÀå Ãâ½Ã ±â°£À» ´ÜÃàÇÒ ¼ö ÀÖ½À´Ï´Ù.

 

 

 

 

 

½Ã½ºÅÛ ±â¼ú »ç¾ç

 

 

NEXTSERVER R2292WK ¼­¹öÇ÷§Æû

 

 

 

 

Form Factor

2U rack enclosure; Up to 4 independent warm-swap compute modules

 

 

CPU

Intel® Xeon® Platinum 9200 Processors with up to 56 cores

 

 

Memory

DDR4 2933 MT/s DIMMS, up to 96x DIMMs per DCB (24 DIMMs per compute module) @ 1DPC

Supports 8GB to 128GB DIMM options, number and capacity configurable

 

 

Storage

Up to 8x M.2 SSDs per DCB with 1U compute modules; Up to 4x M.2 SSDs & 4x hot-swap U.2 NVMe SSDs with 2U Compute Modules M.2 and U.2 number and capacity configurable

 

 

Power Supply

3x hot-swap CRPS 2100W (Platinum) or 1600W (Titanium) PSUs

 

 

Ethernet

Integrated 1Gbase-T RJ45 (two ports per compute module), Optional shared 1Gbase-T RJ45 management port chassis card

 

 

Cooling

Available with high flow rate air-cooling or integrated liquid-cooling options

 

 

I/O

2 x16 Gen3 PCIe slots per 1U compute module; 4 x16 Gen3 PCIe slots per 2U compute module for high-speed networking support

 

 

Manageability

Dedicated, consolidated Management Module

 

 

Security & Serviceability

TPM 2.0 (optional); Hot-swap/redundant fans, and PSUs; light path diagnostic LEDs

 

 

 

 

 

Intel® Xeon® Platinum 9200 ÇÁ·Î¼¼¼­

 

 

SEQ

Cores

Base Frequency

Max Turbo Frequency

L3 Cache

# of UPI Links

Power

 

 

9282

56

2.6 GHz

3.8 GHz

77 MB

4

400W

 

 

9242

48

2.3 GHz

3.8 GHz

71.5 MB

4

350W

 

 

9222

32

2.3 GHz

3.7 GHz

71.5 MB

4

250W

 

 

9221

32

2.3 GHz

3.7 GHz

71.5 MB

4

250W

 

 

 

 

 

NEXTSERVER R2292WK Compute ¸ðµâ

 

 

Modules

 

 

Component

1U Half-Width Liquid-Cooled Compute Module

2U Half-Width Air-Cooled Compute Module

2U Half-Width Liquid-Cooled Compute Module

 

 

CPU

Intel® Xeon® Platinum 9200 Processors with up to 56 cores 400W TDP

Intel® Xeon® Platinum 9200 processors with up to 48 cores 350W TDP

 

 

Memory

DDR4 2933 MT/s DIMMS, up to 24 DIMMs per compute module @ 1DPC; Supports 8GB to 128GB DIMM options, number and

capacity configurable

 

 

Storage

2x M.2 SATA/NVMe SSDs 80 or 110mm

2x M.2 SATA/NVMe SSDs 80 or 110mm & 2x U.2 NVMe hot-swap SSDs, optional RAID 0 & 1 support available on U.2 SSDs

 

 

DCB Configuration

2U/4N liquid-cooled

2U/2N air-cooled

2U/2N liquid-cooled

 

 

I/O

2x Integrated 1Gbase-T RJ45 & 2 x16 Gen3 PCIe slots

2x Integrated 1Gbase-T RJ45 & 4 x16 Gen3 PCIe slots

 

 

Debug Support

Dedicated port for VGA, serial, & 2 USB 2.0 port connectivity

 

 

Cooling

Direct-to-Chip Liquid-Cooling for CPUs, VRs, DIMMs, and Memory VRs

High-Flow Air-Cooling

Direct-to-Chip Liquid-Cooling for CPUs, VRs, DIMMs, and Memory VRs

 

 

 

 

 

NEXTSERVER R2292WK ¼¨½Ã

 

 

Chassis

 

 

Component

2U Front I/O standard-width air-cooled chassis with included rail-kit

2U Front I/O standard-width liquid-cooled chassis with included rail-kit

 

 

Supported Configuration

4x 1U Half-Width Compute Modules; 2x 2U Half-Width Compute Modules; 2x 1U Half-Width Compute Modules & 1x 2U Half-Width Compute Modules

 

 

Cooling

3x 60mm fans & 2x 80mm fans

3x 60mm fans & integrated liquid-cooling manifold (SCG06 external connectors, CGD03 internal connectors)

 

 

Power Supplies

3x hot-swap CRPS 1600W (Titanium) or 2100W (Platinum) PSUs

3x hot-swap CRPS 2100W (Platinum) PSUs

 

 

Options

Optional shared 1GBase-T RJ45 management port chassis card

 

 

 

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