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(ÁÖ)»÷µð¾Æ´Â »õ·Î¿î Intel® Xeon® Platinum 9200 ½Ã¸®Áî ÇÁ·Î¼¼¼ ±â¹ÝÀÇ ¼¹ö Ç÷§ÆûÀ» Ãâ½ÃÇÏ¿´½À´Ï´Ù. »õ·Î¿î ¼¹ö Ç÷§ÆûÀº NEXTSERVER¢â R2292WK 2U4NODE (NS R2292WK) ÀÔ´Ï´Ù. |
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°í¼º´É ÄÄÇ»Æà (HPC) ¹× Àΰø Áö´É ÀÀ¿ë ºÐ¾ß¿¡¼ ÃÖÀûÈµÈ NS R2292WKÀº Intel® Xeon®Platinum 9200 ÇÁ·Î¼¼¼°¡ »ç¿ëµÇ´Â ÃÖ½ÅÀÇ ¼¹ö Ç÷§Æû ÀÔ´Ï´Ù. |
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ÀÎÅÚ® ¼¹ö ½Ã½ºÅÛ S9200WK Á¦Ç°±ºÀº °í¼º´É ÄÄÇ»ÆÃ(HPC) ¹× Àΰø Áö´É ÀÀ¿ë ºÐ¾ß¿¡ »ç¿ëÇϱ⿡ ÀÌ»óÀûÀÎ ¸ÂÃã ±¸ÃàµÈ ¼º´É ÃÖÀûÈ µ¥ÀÌÅÍ ¼¾ÅÍÀÔ´Ï´Ù. ÄÄÇ»Æà ¸ðµâ´ç ÃÖ´ë 24°³ÀÇ DDR4 DIMM ½½·ÔÀÌ ÀÖ´Â 2¼¼´ë ÀÎÅÚ® Á¦¿Â® Ç÷¡Æ¼³Ñ 9200 ÇÁ·Î¼¼¼¿ëÀ¸·Î ¼³°èµÈ ÀÎÅÚ® ¼¹ö ½Ã½ºÅÛ S9200WK Á¦Ç°±ºÀº ÇÁ·Î¼¼¼ ¹× ¸Þ¸ð¸® ´ë¿ªÆøÀ» ±Ø´ëÈÇÏ¿© °¡Àå ±î´Ù·Î¿î ÄÄÇ»Æà »ç¿ëµµ ÃæÁ·ÇÒ ¼ö ÀÖ´Â ÃÖ°í ¼öÁØÀÇ ¼º´ÉÀ» Á¦°øÇÕ´Ï´Ù. |
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ÃÖ°í ¼º´ÉÀÇ 2¼¼´ë Intel® Xeon® Platinum 9200 ÇÁ·Î¼¼¼ |
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¡á |
ÀÎÅÚ¿¡¼ °¡Àå ¸¹Àº ÄÚ¾î ¼ö¿Í ¼ÒÄÏ´ç ÃÖ°íÀÇ CPU ¼º´ÉÀ» º¸¿©ÁÖ´Â 2¼¼´ë Intel® Xeon® Platinum 9200 ÇÁ·Î¼¼¼ |
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¡á |
¸Þ¸ð¸® Áý¾àÀû ¿öÅ©·Îµå¸¦ À§ÇØ CPU´ç 12°³ÀÇ ¸Þ¸ð¸® ä³Î, ÄÄÇ»Æà ¸ðµâ´ç 24 ¸Þ¸ð¸® ä³ÎÀ» ÅëÇØ 2¹èÀÇ ¸Þ¸ð¸® ´ë¿ªÆø Á¦°ø |
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¡á |
µ¥ÀÌÅÍ ºÐ¼®À» À§ÇÑ »õ·Î¿î Intel® Deep Learning Boost (ÀÎÅÚ DL ºÎ½ºÆ®) ÁöħÀ¸·Î Ãß·Ð ¼º´ÉÀ» Å©°Ô ³ôÀ½ |
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¡á |
¹Ðµµ ¹× ¼º´É¿¡ ÃÖÀûÈµÈ ¸ÖƼĨ ÆÐŰ¡ |
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¹Ðµµ¿¡ ÃÖÀûÈµÈ 2U ·¢ ¼¹ö, °ø³Ã Ä𸵠¹× ¼ö³Ã Ä𸵠¿É¼Ç |
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¡á |
´ÜÀÏ ¼¨½Ã¿¡¼ ¿©·¯ ÄÄÇ»Æà ¸ðµâ À¯ÇüÀ» Áö¿øÇÏ´Â 2U ¼¨½Ã´ç ÃÖ´ë 4°³ÀÇ ÄÄÇ»Æà ¸ðµâ |
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¡á |
³ôÀº ¿Àü´ÞÀ²À» À§ÇØ CPU, VR, DIMM ¹× ¸Þ¸ð¸® VR¿¡ ´ëÇØ ³ôÀº È帧À²ÀÇ °ø³Ã½Ä/¼ö³Ã½Ä Äð¸µÀ» Á¦°øÇÏ´Â °í±Þ Ä𸵠±â¼úÀ» °áÇÕÇÑ 2CPU ÄÄÇ»Æà ¸ðµâ µðÀÚÀÎ |
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¡á |
°í¼º´É ¿öÅ©·Îµå¸¦ À§ÇØ 2U °ø·©½Ä Ä𸵠¼¨½Ã¿¡¼ ÃÖ´ë 350W ÇÁ·Î¼¼¼ TDP, ¼ö³Ã½Ä Ä𸵠¹öÀü¿¡¼ ÃÖ´ë 400W ÇÁ·Î¼¼¼ TDP Áö¿ø |
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¡á |
³×Æ®¿öÅ© È®Àå ¿É¼ÇÀ» À§ÇØ 1U ÄÄÇ»Æà ¸ðµâ¿¡¼ 6 PCIe ½½·Ô ÃÖ´ë 2°³, 2U ÄÄÇ»Æà ¸ðµâ¿¡¼ 16 PCIe* ½½·Ô ÃÖ´ë 4°³ Áö¿ø |
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¡á |
1U ÄÄÇ»Æà ¸ðµâ´ç M.2 SATA/NVMe ½ºÅ丮Áö ÀåÄ¡ 2°³, M.2 SATA/NVMe* ÃÖ´ë 2°³, 2U ÄÄÇ»Æà ¸ðµâ´ç U.2 NVMe ½ºÅ丮Áö ÀåÄ¡ ÃÖ´ë 2°³ Áö¿ø |
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¡á |
ÇÖ ½º¿Ò Áö¿ø ÄÄÇ»ÅÍ ¸ðµâ, ½ºÅ丮Áö, ÆÒ ¹× Àü¿ø °ø±ÞÀåÄ¡ |
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¿Ïº®ÇÑ ½Ã½ºÅÛÀ¸·Î Ãâ½Ã |
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(ÁÖ)»÷µð¾Æ NS R2292WK Á¦Ç°±ºÀº ÀÎÅÚ® µ¥ÀÌÅÍ ¼¾ÅÍ ºí·Ï(ÀÎÅÚ® DCB) Áß ÃÖ°í ¼º´ÉÀ» ÀÚ¶ûÇÕ´Ï´Ù. È®½ÇÇÏ°Ô °ËÁõµÇ°í ºê·£µå°¡ ¾ø´Â ÀÌ ¼¹ö ½Ã½ºÅÛ¿¡´Â ¿øÈ°È÷ ÀÛµ¿Çϵµ·Ï ÀÌ¹Ì ÃÖÀûÈµÈ ÀÎÅÚÀÇ ÃֽŠµ¥ÀÌÅÍ ¼¾ÅÍ ±â¼úÀÌ Æ÷ÇԵǾî ÀÖ¾î, ÆÄÆ®³ÊµéÀº ½Å·ÚÇÒ ¼ö ÀÖ´Â µ¥ÀÌÅÍ ¼¾ÅÍ ¼Ö·ç¼ÇÀ¸·Î ½ÃÀå Ãâ½Ã ±â°£À» ´ÜÃàÇÒ ¼ö ÀÖ½À´Ï´Ù. |
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½Ã½ºÅÛ ±â¼ú »ç¾ç |
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NEXTSERVER R2292WK ¼¹öÇ÷§Æû |
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Form Factor |
2U rack enclosure; Up to 4 independent warm-swap compute modules |
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CPU |
Intel® Xeon® Platinum 9200 Processors with up to 56 cores |
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Memory |
DDR4 2933 MT/s DIMMS, up to 96x DIMMs per DCB (24 DIMMs per compute module) @ 1DPC Supports 8GB to 128GB DIMM options, number and capacity configurable |
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Storage |
Up to 8x M.2 SSDs per DCB with 1U compute modules; Up to 4x M.2 SSDs & 4x hot-swap U.2 NVMe SSDs with 2U Compute Modules M.2 and U.2 number and capacity configurable |
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Power Supply |
3x hot-swap CRPS 2100W (Platinum) or 1600W (Titanium) PSUs |
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Ethernet |
Integrated 1Gbase-T RJ45 (two ports per compute module), Optional shared 1Gbase-T RJ45 management port chassis card |
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Cooling |
Available with high flow rate air-cooling or integrated liquid-cooling options |
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I/O |
2 x16 Gen3 PCIe slots per 1U compute module; 4 x16 Gen3 PCIe slots per 2U compute module for high-speed networking support |
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Manageability |
Dedicated, consolidated Management Module |
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Security & Serviceability |
TPM 2.0 (optional); Hot-swap/redundant fans, and PSUs; light path diagnostic LEDs |
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Intel® Xeon® Platinum 9200 ÇÁ·Î¼¼¼ |
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SEQ |
Cores |
Base Frequency |
Max Turbo Frequency |
L3 Cache |
# of UPI Links |
Power |
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9282 |
56 |
2.6 GHz |
3.8 GHz |
77 MB |
4 |
400W |
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9242 |
48 |
2.3 GHz |
3.8 GHz |
71.5 MB |
4 |
350W |
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9222 |
32 |
2.3 GHz |
3.7 GHz |
71.5 MB |
4 |
250W |
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9221 |
32 |
2.3 GHz |
3.7 GHz |
71.5 MB |
4 |
250W |
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NEXTSERVER R2292WK Compute ¸ðµâ |
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Modules |
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Component |
1U Half-Width Liquid-Cooled Compute Module |
2U Half-Width Air-Cooled Compute Module |
2U Half-Width Liquid-Cooled Compute Module |
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CPU |
Intel® Xeon® Platinum 9200 Processors with up to 56 cores 400W TDP |
Intel® Xeon® Platinum 9200 processors with up to 48 cores 350W TDP |
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Memory |
DDR4 2933 MT/s DIMMS, up to 24 DIMMs per compute module @ 1DPC; Supports 8GB to 128GB DIMM options, number and capacity configurable |
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Storage |
2x M.2 SATA/NVMe SSDs 80 or 110mm |
2x M.2 SATA/NVMe SSDs 80 or 110mm & 2x U.2 NVMe hot-swap SSDs, optional RAID 0 & 1 support available on U.2 SSDs |
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DCB Configuration |
2U/4N liquid-cooled |
2U/2N air-cooled |
2U/2N liquid-cooled |
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I/O |
2x Integrated 1Gbase-T RJ45 & 2 x16 Gen3 PCIe slots |
2x Integrated 1Gbase-T RJ45 & 4 x16 Gen3 PCIe slots |
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Debug Support |
Dedicated port for VGA, serial, & 2 USB 2.0 port connectivity |
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Cooling |
Direct-to-Chip Liquid-Cooling for CPUs, VRs, DIMMs, and Memory VRs |
High-Flow Air-Cooling |
Direct-to-Chip Liquid-Cooling for CPUs, VRs, DIMMs, and Memory VRs |
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NEXTSERVER R2292WK ¼¨½Ã |
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Chassis |
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Component |
2U Front I/O standard-width air-cooled chassis with included rail-kit |
2U Front I/O standard-width liquid-cooled chassis with included rail-kit |
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Supported Configuration |
4x 1U Half-Width Compute Modules; 2x 2U Half-Width Compute Modules; 2x 1U Half-Width Compute Modules & 1x 2U Half-Width Compute Modules |
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Cooling |
3x 60mm fans & 2x 80mm fans |
3x 60mm fans & integrated liquid-cooling manifold (SCG06 external connectors, CGD03 internal connectors) |
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Power Supplies |
3x hot-swap CRPS 1600W (Titanium) or 2100W (Platinum) PSUs |
3x hot-swap CRPS 2100W (Platinum) PSUs |
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Options |
Optional shared 1GBase-T RJ45 management port chassis card |
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¢ß»÷µð¾Æ | ´ëÇ¥ÀÌ»ç: À̽¼ö | »ç¾÷ÀÚµî·Ï¹øÈ£: 214-87-15893 | ¸ÞÀÏ: sales@sandia.co.kr º»»ç: °æ±âµµ ¿ëÀνà ¼öÁö±¸ ½Å¼ö·Î 767 ºÐ´ç¼öÁöÀ¯Å¸¿ö Aµ¿ 618È£ | ÀüÈ: 031-229-1603 | Æѽº: 031-229-1604 ´ëÀü: ´ëÀü±¤¿ª½Ã À¯¼º±¸ Å×Å©³ë3·Î 65 Çѽſ¡½º¸ÞÄ« 242È£ | ÀüÈ: 042-824-1603 | Æѽº: 042-824-1603 Copyright(C) 2019 SANDIA. INC All Right Reserved. |